We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Die Bonder.
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Die Bonder Product List and Ranking from 7 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Die Bonder Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 兼松ＰＷＳ Kanagawa//Industrial Machinery
  2. テクサス Tokyo//Industrial Machinery
  3. ファスフォードテクノロジ Yamanashi//Industrial Machinery
  4. 4 ファインテック日本 Tokyo//Industrial Electrical Equipment
  5. 5 Woyton Technologies Kanagawa//Trading company/Wholesale
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Die Bonder Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Texas Corporation Business Introduction テクサス
  2. ASMPT manufactured flip chip bonder/die bonder AFCPlus 兼松ＰＷＳ
  3. Fasford Technology "SiP Bonder (DB830plus+)" ファスフォードテクノロジ
  4. 4 ASMPT manufactured flip chip bonder/die bonder CoS 兼松ＰＷＳ
  5. 5 [Application Example] Implementation of VCSEL and PD using a high-precision die bonder. ファインテック日本

Die Bonder Product List

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ASMPT manufactured flip chip bonder/die bonder CoS

ASMPT manufactured flip chip bonder/die bonder CoS

CoS (Chip on Submount) is a high-precision die/flip chip bonder.

CoS Alignment Accuracy: ±3µm@3σ Applications: Mainly laser applications The company's products utilize laser heating, allowing for rapid heating implementation compared to pulse heaters. Cycle Time: 5–15 sec/chip Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported. 〇 Other Die Bonder/Flip Chip Bonder Equipment Alignment Accuracy NANO ±0.3µm @ 3σ AFCplus ±1μm@3σ Nova + ±2.5μm@3σ 〇 Other ASMPT Equipment Available - Multi-laser dicing equipment - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm–25µm) 〇 ASMPT Equipment Installation Achievements (Total Domestic and International): 2000 units per year for die bonders, 4000 units per year for wire bonders.

  • Bonding Equipment

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Texas Corporation Business Introduction

Texas Corporation Business Introduction

Thoroughly manage the situation and take action based on the guidelines to "raise" it.

Texas Corporation inherits the die bonding technology of Nidec Tosok Corporation and practices the automation of semiconductor manufacturing equipment based on that technology. We implement a safety-first management philosophy, thoroughly manage pre-conditions, and act in accordance with our guiding principles. 【Product Information】 ○DBD4200R / EBD4200R ○DBD4600S / EBD4600 ○DBD3580SW ○EBD4350S For more details, please contact us or download the catalog.

  • Other semiconductor manufacturing equipment

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[Application Example] Implementation of VCSEL and PD using a high-precision die bonder.

[Application Example] Implementation of VCSEL and PD using a high-precision die bonder.

Bonding position accuracy of 0.5µm!

In the latest applications of optical devices, high data transfer speeds, composite transmitters, receivers, and mixed elements are important components. In the implementation process of these components, precise position control through appropriate bonding techniques is required.

  • Bonding Equipment

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Fasford Technology "SiP Bonder (DB830plus+)"

Fasford Technology "SiP Bonder (DB830plus+)"

Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.

The FASFOR Technology "SiP Bonder (DB830plus+)" is a high-speed, high-performance die bonder that has further evolved from the DB800, which is specifically designed for SiP assembly and compatible with 300mm wafers. It achieves high quality and high productivity through the use of an intermediate stage and is equipped with a vision system that supports positional correction for multi-layer stacking. With clean technology to reduce particles during stacking, it is the optimal die bonder for thin dies and multi-layer stacking. 【Features】 - High quality and high productivity - Multi-layer stacking support - Thin die bonding technology - Clean technology For more details, please contact us or download the catalog.

  • Bonding Equipment

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ASMPT manufactured flip chip bonder/die bonder AFCPlus

ASMPT manufactured flip chip bonder/die bonder AFCPlus

AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.

"AFC Plus" is a device that enables bonding of high-precision, diced chips to wafers/substrates/dies using the company's patented alignment technology. 【Features】 - Alignment accuracy: ±1µm @ 3s - Alignment technology (patented) - Bonding methods during the joining process - Extensive track record in optical communication and silicon photonics - Rich experience in MEMS sensors, LiDAR, VCSEL, etc. - Extensive experience in R&D and mass production facilities 【Main Specifications】 - Alignment accuracy: ±0.2µ@3σ - Cycle time: 20 to 30 sec (varies by material) - Die size: 0.1mm to 20mm - Substrate size: MAX 300 x 300 mm - Bonding force (load): 10g to 2kg - Joining methods: eutectic solder, epoxy, UV-curable resin, laser bonding *Ultrasonic bonding is not supported.

  • Bonding Equipment

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Notice of Participation in "SEMICON JAPAN 2023"

Notice of Participation in "SEMICON JAPAN 2023"

Various manufacturers' products are scheduled to be exhibited! Such as die bonders and mask aligner devices.

Kanematsu PWS Corporation will be exhibiting at "SEMICON JAPAN 2023" held at Tokyo Big Sight. We plan to showcase various products, including ASMPT's backend equipment (die bonders, wire bonders, etc.), SUSS's mask aligners, coaters/developers, and more. We sincerely look forward to your visit. 【Exhibition Overview】 ■ Date: December 13 (Wed) to December 15 (Fri), 2023, 10:00 AM to 5:00 PM ■ Venue: Tokyo Big Sight (East Exhibition Hall) Hall 1 ■ Booth Location: 1704 ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 *For more details, please refer to the related links or feel free to contact us.

  • Other processing machines

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Dai Bonder "MEGA"

Dai Bonder "MEGA"

Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.

"MEGA" is a device that allows multiple types of chips to be bonded to a single substrate in one pass. By adding options, it is possible to vary the precision within a range of 25μm to 2μm. Additionally, it is equipped with comprehensive inspection functions that allow for quality checks before and after bonding. It can be used for various applications such as small-batch production, mass production, and R&D. 【Overview】 ■ Manufacturer: ASMPT ■ Product Name: Multi-chip compatible die bonder for epoxy bonding, UV bonding *For more details, please refer to the PDF document or feel free to contact us.

  • Bonding Equipment

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Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision flip chip bonder/die bonder FDB210P

Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.

This machine is a flip chip bonder that is optimal for mass production of optical devices that require both sub-micron level ultra-high precision assembly and high production, as well as devices that require high precision mounting. It also supports face-up mounting as an option.

  • Bonding Equipment

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Dia Attach System

Dia Attach System

Supporting the ever-evolving semiconductor applications!

We handle the die attach systems from Besi. To meet the ever-evolving semiconductor applications, we continue to evolve with advanced technology. Please feel free to contact us if you have any requests. 【Four Categories】 ■ Multi-Module Bonder ■ Epoxy Die Bonder ■ Soft Solder Die Bonder ■ Flip Chip Bonder *For more details, please download the PDF or contact us.

  • Other semiconductor manufacturing equipment
  • Bonding Equipment

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[Customer Case] Die Bonder Supporting Stacking Implementation of Membrane Chips

[Customer Case] Die Bonder Supporting Stacking Implementation of Membrane Chips

We are stacking delicate membrane chips with a post-bonding accuracy of less than 1μm!

The Microelectronics Research Institute in Stuttgart conducts business-oriented research in fields such as silicon technology, application-specific integrated circuits (ASICs), nanostructures, and image sensor technology, and provides specialized training. In new applications, it has become a critical requirement to stack membrane chips of a few centimeters in size with very high precision. After all steps of placement and stacking are completed, the post-bonding accuracy for the entire process must be less than 1μm. This case study introduces a "die bonder compatible with stacking implementation of membrane chips with a post-bonding accuracy of 1μm." *For more detailed information about the case study, please refer to the PDF materials. Feel free to contact us for more details.*

  • Other mounting machines

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[Customer Case] Utilization of High-Precision Die Bonder

[Customer Case] Utilization of High-Precision Die Bonder

We provide advanced research facilities for microsystem technology to our partners!

We will introduce how the University of South-Eastern Norway is utilizing assembly equipment from Finetech to promote innovation at one of Norway's leading microtechnology hubs. The University of South-Eastern Norway (USN), which has 20,000 students across eight campuses, is one of the educational institutions in Norway. This university, which was formed by the merger of three regional colleges, currently offers a variety of bachelor's, master's, and doctoral programs in many scientific fields. In addition, USN not only plays an important role in domestic and international research and education but is also closely linked to one of the dynamic economic regions. This case study introduces the use of high-precision die bonders in the "Electronic Coast." *For more detailed information about the case study, please refer to the PDF document. Feel free to contact us for more details.

  • Other mounting machines

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[Research Material] Global Market for Semiconductor Assembly Process Equipment

[Research Material] Global Market for Semiconductor Assembly Process Equipment

Global Market for Semiconductor Assembly Process Equipment: Die Bonders, Wire Bonders, Packaging Equipment, Others, IDM, OSAT

This research report (Global Semiconductor Assembly Process Equipment Market) investigates and analyzes the current status and outlook for the global market of semiconductor assembly process equipment over the next five years. It includes information on the overview of the global semiconductor assembly process equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include die bonders, wire bonders, packaging equipment, and others, while the segments by application focus on IDM and OSAT. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of semiconductor assembly process equipment. It also includes the market share of major companies in semiconductor assembly process equipment, product and business overviews, and sales performance.

  • Other services

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[Research Material] Global Market for Semiconductor Assembly Equipment

[Research Material] Global Market for Semiconductor Assembly Equipment

World Market for Semiconductor Assembly Equipment: Die Bonders, Wire Bonders, Packaging Equipment, Others, IDM, OSAT

This research report (Global Semiconductor Assembly Equipment Market) investigates and analyzes the current state of the global semiconductor assembly equipment market and its outlook for the next five years. It includes information on the overview of the global semiconductor assembly equipment market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor assembly equipment market include die bonders, wire bonders, packaging equipment, and others, while the segments by application focus on IDM and OSAT. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of semiconductor assembly equipment. It also includes the market share of major companies in semiconductor assembly equipment, product and business overviews, and sales performance.

  • Other services

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